1N4744AGE3
Microchip Technology
Through HoleBag-65°C~175°C
Ref. price$3.2000
Lead time on requestGet quote
Microchip Technology 1N4744 Series
22 variants · Microchip Technology
About the Microchip Technology 1N4744 Series
The Microchip Technology 1N4744 Series series groups 22 related part numbers, each listed with full specifications, a datasheet where available, and an RFQ option. The listed variants share a common current - reverse leakage @ vr of 5 µA @ 11.4 V, impedance (Max) of 14 Ohms and power - max of 1 W. Variants differ by case, mounting and operating temperature, so you can match the exact case your application requires using the selection guide below.
Select a variant by
- Case
- DO-204AL, DO-41, Axial · DO-213AB, MELF · DO-213AB, MELF (Glass)
- Mounting
- Surface Mount · Through Hole
- Operating temperature
- -65°C ~ 175°C · -65°C~150°C · -65°C~175°C
- Package
- Bag · Bulk · Tape & Reel (TR) · Tape & Reel (TR) Cut Tape (CT) · Tape & Reel (TR); Cut Tape (CT)
- Tolerance
- ±2% · ±5% · ±10%
Shared specifications
- Current - reverse leakage @ vr
- 5 µA @ 11.4 V
- Impedance (Max)
- 14 Ohms
- Power - max
- 1 W
- Voltage - forward (Vf) (Max) @ if
- 1.2 V @ 200 mA
- Voltage - zener (Nom)
- 15 V
Variant comparison
| Parameter | 1N4744AGE3 | 1N4744UR-1/TR | 1N4744AG | 1N4744AG/TR | 1N4744APE3/TR12 | 1N4744APE3/TR8 |
|---|---|---|---|---|---|---|
| Case | DO-204AL, DO-41, Axial | DO-213AB, MELF (Glass) | DO-204AL, DO-41, Axial | DO-204AL, DO-41, Axial | DO-204AL, DO-41, Axial | DO-204AL, DO-41, Axial |
| Mounting | Through Hole | Surface Mount | Through Hole | Through Hole | Through Hole | Through Hole |
| Operating temperature | -65°C~175°C | -65°C ~ 175°C | -65°C ~ 175°C | -65°C ~ 175°C | -65°C~150°C | -65°C~150°C |
| Package | Bag | Tape & Reel (TR) Cut Tape (CT) | Bulk | Tape & Reel (TR) | Tape & Reel (TR) | Tape & Reel (TR) |
| Tolerance | ±5% | ±10% | ±5% | ±5% | ±5% | ±5% |
Request a quote on any Microchip Technology 1N4744 Series part number and we confirm price, availability and lead time per line — including end-of-life and allocation-constrained variants.
