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Lattice Semiconductor OR2C15A4BA256-DB — FPGA / CPLD & Programmable Logic

Lattice OR2C15A4BA256-DB ORCA 2 FPGA, 44200 gates

MPNOR2C15A4BA256-DB
Active

Lattice Semiconductor ORCA™2 FPGA, OR2C15A4BA256-DB, 44200 gates, 1600 logic cells, 223 I/O, 25600 bits RAM, 4.75 V, 0°C to 70°C, Surface Mount.

$50.85Ref. price · indicative, final on quote
Independent supplier — new & surplus stockAuthenticity-screened · ESD-safe packingListing updated Aug 2026

Specifications

OR2C15A4BA256-DB specifications
ParameterValue
SeriesORCA™2
MountingSurface Mount
Operating temperature high0°C to 70°C (TA)
Package_typeBulk
Number of i (O)223
Total ram bits25600
StatusActive
Number of gates44200
Supply voltage4.75
Number of logic elements (Cells)1600

Product details

The OR2C15A4BA256-DB is a Lattice ORCA™2 FPGA with 44200 usable gates and 223 I/O pins. That I/O count is the headline number here — it lets you route a wide parallel bus (say a 16-bit data + address + control) alongside a bunch of discrete sensor or actuator lines without needing an external I/O expander or a second FPGA. On-chip RAM totals 25600 bits. That is enough for a small FIFO buffer, a register file for a soft-core state machine, or a few look-up tables — not enough for a frame buffer, but plenty for glue-logic scratchpad. The 1600 logic cells handle medium-density combinatorial and sequential logic — think address decoding, bus arbitration, or a simple custom peripheral interface. The commercial temperature range (0°C to 70°C) suits indoor equipment, lab instruments, and benchtop gear.

The supply voltage is 4.75 V — a legacy 5 V nominal rail.

Surface Mount package — the specific footprint is a 256-ball BGA. That means reflow assembly, not hand-soldering with an iron. A hot-air station or reflow oven is required; the pitch is fine enough that a stencil and paste are recommended for reliable joints. The 223 I/O fan out across the BGA grid. A 4-layer PCB with a dedicated ground and power plane is the practical minimum for signal integrity — two-layer boards will struggle to route the inner balls without vias stacking up.