Skip to main content
Lattice Semiconductor Corporation LFE5U-12F-6BG256C — FPGA / CPLD & Programmable Logic

Lattice LFE5U-12F-6BG256C ECP5 FPGA, 12K LEs, 197 I/O

MPNLFE5U-12F-6BG256C
Active

Lattice Semiconductor Corporation ECP5 FPGA, LFE5U-12F-6BG256C, 12000 logic elements, 197 I/O, 589824 total RAM bits, 256-CABGA package, Tray.

$15.2500Ref. price · indicative, final on quote
Packaging256-LFBGA
RoHSROHS3 Compliant
SeriesECP5
Independent supplier — new & surplus stockAuthenticity-screened · ESD-safe packingListing updated Aug 2026

Specifications

LFE5U-12F-6BG256C specifications
ParameterValue
SeriesECP5
MountingSurface Mount
Supply voltage1.045V ~ 1.155V
Operating temperature0°C ~ 85°C (TJ)
PackageTray
Number of i (O)197
Case256-LFBGA
Total RAM bits589824
Number of LABs (CLBs)3000
Number of logic elements (Cells)12000

Product details

12K logic elements in a 14x14 mm BGA

The LFE5U-12F-6BG256C is a Lattice ECP5 FPGA packing 12000 logic elements and 197 user I/O in a 256-ball CABGA package measuring 14x14 mm. With 589824 bits of embedded block RAM, it handles moderate data buffering and line-rate processing for glue-logic bridging, sensor fusion, or small-footprint control-plane tasks.

I/O count and supply rails

197 available I/O pins give the designer enough headroom for a parallel bus, multiple SPI or I2C peripherals, and a DDR memory interface without starving the remaining GPIO. The core supply operates from 1.045 V to 1.155 V — a 1.1 V rail with 5 % tolerance covers the window, which is typical for 28 nm FPGAs. The 3000 logic-array blocks (LABs/CLBs) map to the 12K LUT count; each block contains four slices, so the synthesis tool has 12000 4-input LUTs and 12000 flip-flops to work with. For a 32-bit RISC-V soft-core plus a UART and SPI master, expect about 40 % utilisation — leaving room for a small state machine or CRC accelerator.

Temperature grade and board integration

It fits indoor equipment, networking gear, and industrial controllers with forced air or a heatsink. For outdoor or under-hood deployment, the industrial-temperature peer LFE5U-12F-6BG256I covers -40 °C to 100 °C (TJ) in the same footprint. The 256-CABGA (14x14 mm) uses a 1.0 mm ball pitch — a 4-layer PCB with via-in-pad or microvias can fan out all 197 signals. The 0.8 mm seated height keeps the package low-profile for mezzanine or card-edge assemblies.

Frequently asked questions

How do I get current pricing and availability for LFE5U-12F-6BG256C?

Submit an RFQ with your target quantity. The part is sourced through authorized and independent channels.

Will LFE5U-12F-6BG256C drop into a board laid out for LFE5U-12F-6BG256I?

Yes, the two share the same 256-CABGA package, ball map, and 197 I/O count. No PCB spin or rewiring is needed to swap them.