Lattice Semiconductor Corporation LCMXO3LF-6900C-6BG324C — FPGA / CPLD & Programmable Logic
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Lattice Semiconductor Corporation / FPGA / CPLD & Programmable Logic

LCMXO3LF-6900C-6BG324C Lattice MachXO3 FPGA, 6864 LUTs

MPN LCMXO3LF-6900C-6BG324C
Active Spot Stock · 24-48h Dispatch 100% Original Sealed

Lattice Semiconductor Corporation MachXO3 FPGA, LCMXO3LF-6900C-6BG324C, 6864 logic elements, 279 I/O, 245760 total RAM bits, 324-CABGA (15x15 mm), 0°C to 85°C, ROHS3 compliant.

In Stock: 107 pcs
MOQ: 1 pcs
Logistics: DHL / FedEx DAP (Global Express · 3-7d) Russia & CIS DDP (Door-to-Door Cleared)
Dispatch: Shenzhen / HK
Unit Price (USD)
$26.00 / pc
Direct Purchase Ready
Volume Pricing Breaks Confirmed upon quotation
1+ pcs
$26.00
10+ pcs
$23.40
30+ pcs
$21.32
100+ pcs
$19.24
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$26.00 / ea

107 in stock — maximum per order · 3–4 days lead time

$23.40 / ea from 10 pcs

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[SPEC] Essential Parameters Snapshot Full Specifications (10)
Package / Case 324-LFBGA
Supply Voltage 2.375V ~ 3.465V

Full Technical Specifications

10 Parameters
LCMXO3LF-6900C-6BG324C specifications
Parameter / AttributeSpecification / Value
SeriesMachXO3
MountingSurface Mount
Supply voltage2.375V ~ 3.465V
Operating temperature0°C ~ 85°C (TJ)
PackageTray
Number of i (O)279
Case324-LFBGA
Total RAM bits245760
Number of LABs (CLBs)858
Number of logic elements (Cells)6864
Series Sibling Variants

Lattice Semiconductor Corporation MachXO3 Series Models

Sibling variants, package options, and speed/density grades in this Lattice Semiconductor Corporation semiconductor series. Active Shenzhen warehouse allocation and rapid 24-48h dispatch.

Technical Details & Description

The Lattice LCMXO3LF-6900C-6BG324C carries an Active lifecycle status — the manufacturer continues to support this order code for new and existing designs.

Logic density and I/O — what 6864 LUTs and 279 I/O mean for fit

6864 logic elements (LUTs) arranged in 858 LABs, paired with 245760 bits of block RAM — this is a mid-density instant-on FPGA suited for glue logic, bus bridging, and control-plane functions that need deterministic power-up configuration without an external configuration memory.

Temperature grade and deployment boundary

It is not qualified for extended industrial (-40°C) or automotive environments. Designs for outdoor telecom, engine-bay, or cold-storage applications require the industrial-temperature variant of the same logic core. The 324-CABGA (15x15 mm) footprint with 1.0 mm ball pitch is compatible with standard JEDEC reflow profiles.

No stock-holding claim is made; each order is sourced per RFQ.

Frequently asked questions

How do I get current pricing and availability for LCMXO3LF-6900C-6BG324C?

Submit an RFQ against your BOM quantity. No stock-holding claim is made on this page.

What is the closest functional second-source to LCMXO3LF-6900C-6BG324C?

The LCMXO3LF-6900C-6BG400I shares the same logic core (6864 LUTs, 858 LABs, 245760-bit RAM) but offers 335 I/O in a 400-ball BGA. The 324-ball and 400-ball packages are not footprint-compatible — a board layout change is required to swap between them.

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