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Lattice Semiconductor Corporation LCMXO3D-9400ZC-2BG256C — FPGA / CPLD & Programmable Logic

Lattice LCMXO3D-9400ZC-2BG256C FPGA, 9400 LUTs, 206 I/O

MPNLCMXO3D-9400ZC-2BG256C
Active

Lattice Semiconductor Corporation MachXO3D FPGA, LCMXO3D-9400ZC-2BG256C, 9400 logic cells, 206 I/O, 442368 total RAM bits, 256-LFBGA package, Tray.

$28.7000Ref. price · indicative, final on quote
Packaging256-LFBGA
SeriesMachXO3D
Independent supplier — new & surplus stockAuthenticity-screened · ESD-safe packingListing updated Aug 2026

Specifications

LCMXO3D-9400ZC-2BG256C specifications
ParameterValue
SeriesMachXO3D
MountingSurface Mount
Supply voltage2.375V ~ 3.465V
Operating temperature0°C~85°C(TJ)
PackageTray
Number of i (O)206
Case256-LFBGA
Total RAM bits442368
Number of LABs (CLBs)1175
Number of logic elements (Cells)9400

Product details

9400 LUTs in a 14x14 mm BGA — logic density vs I/O trade

The Lattice LCMXO3D-9400ZC-2BG256C packs 9400 logic elements (1175 LABs/CLBs) into a 256-ball CABGA (14x14 mm) package, with 206 user I/O brought out. This ratio — 9400 LUTs for 206 I/O — tells you the part is logic-heavy relative to its pin count; it fits designs that need moderate gate depth but not a wide external bus. The 442368 total RAM bits provide small FIFO or register-file storage on-chip. The commercial temperature grade (0 °C to 85 °C junction) limits deployment to controlled indoor environments — no engine bay or rooftop duty.

Active lifecycle — no EOL overhang

Lattice lists the LCMXO3D-9400ZC-2BG256C as Active.

Footprint and board integration

The 256-ball CABGA (14x14 mm) uses a 0.80 mm ball pitch — a 4-layer PCB with via-in-pad or microvia fan-out is the practical minimum. The surface-mount package reflows with a standard lead-free profile; no moisture sensitivity level is stated in the record, so bake per J-STD-020 if the shelf life is exceeded.