640-logic-cell FPGA in a 1.4×1.48 mm WLCSP
The ICE40UL640-SWG16ITR1K is a member of Lattice's iCE40 UltraLite™ family, packing 640 logic elements and 57,344 bits of block RAM into a 16-bump WLCSP measuring just 1.4×1.48 mm. Ten user I/O are available on the 16-XFBGA package, making this part suited for glue-logic, sensor bridging, or simple state-machine roles where board real estate is the tightest constraint.
Supply, temperature, and package fit
Core voltage is 1.14 V to 1.26 V — a single 1.2 V rail with ±5 % tolerance covers the range, so no extra regulator is needed if the board already carries a 1.2 V supply. The industrial temperature grade spans -40°C to 100°C (TJ), covering most embedded and outdoor equipment without the cost of a full military-range part. The 16-WLCSP (1.4×1.48) footprint requires a fine-pitch PCB process — the 0.4 mm ball pitch typical of this package class means a 4-layer board with microvias is the practical floor for fan-out.
ROHS3 compliant per, with no halogen or lead restrictions beyond the standard exemption set.