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Lattice Semiconductor Corporation ICE40UL640-CM36AI — FPGA / CPLD & Programmable Logic
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RoHS Compliant · Lead-Free EIA-481 Standard
Lattice Semiconductor Corporation / FPGA / CPLD & Programmable Logic

Lattice ICE40UL640-CM36AI iCE40 UltraLite FPGA, 640 LEs

MPN ICE40UL640-CM36AI
Active Spot Stock · 24-48h Dispatch 100% Original Sealed

Lattice Semiconductor Corporation iCE40 UltraLite™ FPGA, ICE40UL640-CM36AI, 640 logic elements, 57344 bits RAM, 26 I/O, 36-UCBGA (2.5x2.5), -40°C to 100°C, Tray.

In Stock: 568 pcs
MOQ: 1 pcs
Logistics: DHL / FedEx DAP (Global Express · 3-7d) Russia & CIS DDP (Door-to-Door Cleared)
Dispatch: Shenzhen / HK
Unit Price (USD)
$3.00 / pc
Direct Purchase Ready
Volume Pricing Breaks Confirmed upon quotation
1+ pcs
$3.00
10+ pcs
$2.70
30+ pcs
$2.46
100+ pcs
$2.22
500+ pcs
$2.07
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$3.00 / ea

568 in stock — maximum per order · 3–4 days lead time

$2.70 / ea from 10 pcs
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100% Original Sealed 45x Microscope QC 30-Day Warranty · COC USD T/T & PI · DAP/DDP
[SPEC] Essential Parameters Snapshot Full Specifications (10)
Package / Case 36-VFBGA
Supply Voltage 1.14V ~ 1.26V
ALT
Facing long factory lead times or allocation on ICE40UL640-CM36AI? Verified pin-compatible alternatives available with active Shenzhen stock and 100% solder-ready footprint match.
View Pin Alternates (3)

Full Technical Specifications

10 Parameters
ICE40UL640-CM36AI specifications
Parameter / AttributeSpecification / Value
SeriesiCE40 UltraLite™
MountingSurface Mount
Supply voltage1.14V ~ 1.26V
Operating temperature-40°C ~ 100°C (TJ)
PackageTray
Number of i (O)26
Case36-VFBGA
Total RAM bits57344
Number of LABs (CLBs)80
Number of logic elements (Cells)640
100% Footprint Match · Solder-Ready (No PCB Redesign Needed)

Need Stock or a Drop-in Second-Source for ICE40UL640-CM36AI?

Package: QFN / ucBGA / WLCSP / TQFP · Pin-compatible replacements with immediate Shenzhen spot stock

Footprint Match 97%
Supply Chain & Allocation Reality:

The iCE40 line is the FPGA family that the hobby and small-batch world actually uses - and the data says the same thing about buyers: searches concentrate on Lattice CPLD and iCE40 class parts while Xilinx orderables sit at the noise floor. The family is five sub-splits with wildly different capabilities (UltraLite to UltraPlus) sharing a naming theme and a common trait: an SRAM fabric that must be loaded at every power-up - from an external SPI flash, a host CPU, or the family-internal NVCM. The sourcing consequence is structural: an iCE40 socket is never just an FPGA line on the BOM; it is a two-part relationship with a configuration memory.

Verified Pin-Compatible Replacements (3 verified alternatives)

iCE40UP5K Lattice Semiconductor QFN-48 / SG48 / WLCSP
Functional Equivalent
Availability & Target Pricing:

The UltraPlus Flagship

Shenzhen Spot Stock (24-48h Dispatch)

Electrical & Core Specs:

The richest sub-split: 5,280 LUTs with 1Mb of SPRAM (four 256kb blocks), DSP blocks, two hardened SPI and two I2C blocks, and on-chip oscillators - built for always-on sensor buffering and audio pre-processing.

Low-power single-rail design point; the UltraPlus is the part behind most current iCE40 designs.

Compatibility & Drop-In Notes: Sub-splits are not interchangeable: LP/HX/Ultra/UltraLite/UltraPlus differ in logic, memory and hardened IP. Replacing one with another is a re-synthesis and placement project, and the pin maps differ even in the same package size.
Package & Solder Footprint: Common QFN-48-class outlines are shared - verify pin map against the exact device, not the package.
Shenzhen Warehouse Stock & MOQ: Stocked with config flash paired on request (W25Q-class SPI flash sourced on the same order).
Request Volume Quote for iCE40UP5K Compare ICE40UL640-CM36AI vs iCE40UP5K Spec Matrix
iCE40HX1K Lattice Semiconductor TQFP-144 / VQFP-100 / QFN
Functional Equivalent
Availability & Target Pricing:

The Performance Sub-Split

Shenzhen Spot Stock (24-48h Dispatch)

Electrical & Core Specs:

The HX line trades standby current for more logic per die (HX1K/4K/8K against LP1K/4K/8K); the classic hobby board part of the iCE40 generation.

Low-power but not the micropower LP class; check the static current against the design budget.

Compatibility & Drop-In Notes: LP and HX are the two faces of the same generation: the pin maps match within a device size, but the power and clocking characteristics differ. In repair of hobby-era boards, match the exact device.
Package & Solder Footprint: Larger through-hole-friendly VQFP/TQFP outlines exist in this line.
Shenzhen Warehouse Stock & MOQ: Stocked for repair of the hobby and education ecosystem boards.
Request Volume Quote for iCE40HX1K Compare ICE40UL640-CM36AI vs iCE40HX1K Spec Matrix
ECP5 Lattice Semiconductor caBGA / csBGA families
Functional Equivalent
Availability & Target Pricing:

The Step-Up Platform

Shenzhen Spot Stock (24-48h Dispatch)

Electrical & Core Specs:

The next class above iCE40 in the Lattice stack: higher logic density and hardened high-speed interfaces for video, networking and instrumentation designs.

Multi-rail FPGA supply design - not a drop-in to any iCE40 socket.

Compatibility & Drop-In Notes: Listed to complete the Lattice map - the two families share tooling (Lattice Radiant) but nothing electrical. The honest cross-family statement: re-design, not replacement.
Package & Solder Footprint: BGA-only packaging; assembly and inspection requirements differ from iCE40 QFN work.
Shenzhen Warehouse Stock & MOQ: Stocked per part number with photographed markings - BGA FPGAs are a favored relabeling target.
Request Volume Quote for ECP5 Compare ICE40UL640-CM36AI vs ECP5 Spec Matrix
Buyer & Quality Checklist for Sourcing Alternatives
  • Every iCE40 is SRAM-based: the design lives in configuration memory loaded at power-up (external SPI flash, host controller, or NVCM where present). A board without its config flash is a board with a blank FPGA - when sourcing iCE40, source the paired W25Q-class flash on the same order.
  • The five sub-splits (UltraLite / LP / HX / Ultra / UltraPlus) are different devices, not grades of one device: logic, memory, DSP and hardened IP differ, and the same-size package does not imply the same pin map.
  • Small packages drop features: several mini outlines have no PLL, and the constant-current LED sink exists on selected packages only. The package letter in the orderable number is a spec, not a shipping choice.
  • NVCM configurations are instant-on and secure but one-shot - production planning for NVCM-programmed devices needs lead time and programming decisions upstream, not at the bench.
  • The market leans Lattice for this class (buyer searches concentrate here, not on Xilinx orderables): keep depth in iCE40 and the config flash, with ECP5 quoted case-by-case.
  • iCE40 boards in the repair channel are numerous (hobby, education, instrumentation): the two failure parts are the FPGA and its config flash - check the flash first, it is cheaper and it holds the bitstream.
Frequently Asked Technical Questions

Q: Which iCE40 sub-family do I need?

A: Choose by need: UltraPlus (UP5K) when on-chip SPRAM or DSP is required; HX/LP for general low-power logic with more density; Ultra for mobile glue logic with hardened SPI/I2C; UltraLite for the absolute smallest always-on designs. Sub-splits are not interchangeable.

Q: Does iCE40 need an external flash chip?

A: It configures at every power-up: from an external SPI flash in self-boot mode, from a host CPU in slave mode, or from the internal NVCM where the design was programmed there. Most boards carry a small W25Q-class SPI flash for the bitstream - source it with the FPGA.

Q: Can I replace a dead iCE40 with an ECP5?

A: No - different family, different packaging and supply design. ECP5 is the step-up platform for higher density and interfaces; migrating is a re-layout and re-synthesis project.

Technical Details & Description

The ICE40UL640-CM36AI is a member of Lattice's iCE40 UltraLite™ family, delivering 640 logic elements and 80 logic array blocks in a 36-ball 2.5x2.5 mm 36-UCBGA package. This density and footprint suit it for glue-logic, sensor interface, or simple state-machine roles where board real estate is the binding constraint. On-chip memory totals 57344 bits of RAM, and 26 user I/O are brought out to the BGA balls.

Lattice Semiconductor lists the ICE40UL640-CM36AI as Active product status. The device is ROHS3 Compliant, meeting the current restriction-of-hazardous-substances directive for lead-free assembly. For a BOM line requiring a small-footprint FPGA with industrial temperature qualification, this part is an active, RoHS-compliant choice. Sourcing is confirmed per RFQ through independent distribution channels.

The 36-VFBGA package (supplier device package 36-UCBGA, 2.5x2.5 mm) is a fine-pitch BGA requiring a multi-layer PCB for fan-out of the 26 I/O and supply balls. Surface-mount assembly with a standard reflow profile for lead-free solder is expected. The 1.14 V to 1.26 V core supply is a single narrow-rail domain; the board designer should place decoupling capacitors close to the BGA balls per Lattice's layout guidelines for the iCE40 UltraLite family.

Frequently asked questions

What is the closest functional alternative to ICE40UL640-CM36AI?

The ICE40LP384-SG32 is a lower-density sibling in the iCE40 LP series with 384 logic elements and 21 I/O in a 32-pin QFN package. It is not a pin-compatible drop-in — the package and ball-out differ — but it serves a similar glue-logic role with a smaller logic budget.

ICE40UL640-CM36AI
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