The ICE40UL640-CM36AI is a member of Lattice's iCE40 UltraLite™ family, delivering 640 logic elements and 80 logic array blocks in a 36-ball 2.5x2.5 mm 36-UCBGA package. This density and footprint suit it for glue-logic, sensor interface, or simple state-machine roles where board real estate is the binding constraint. On-chip memory totals 57344 bits of RAM, and 26 user I/O are brought out to the BGA balls.
Lattice Semiconductor lists the ICE40UL640-CM36AI as Active product status. The device is ROHS3 Compliant, meeting the current restriction-of-hazardous-substances directive for lead-free assembly. For a BOM line requiring a small-footprint FPGA with industrial temperature qualification, this part is an active, RoHS-compliant choice. Sourcing is confirmed per RFQ through independent distribution channels.
The 36-VFBGA package (supplier device package 36-UCBGA, 2.5x2.5 mm) is a fine-pitch BGA requiring a multi-layer PCB for fan-out of the 26 I/O and supply balls. Surface-mount assembly with a standard reflow profile for lead-free solder is expected. The 1.14 V to 1.26 V core supply is a single narrow-rail domain; the board designer should place decoupling capacitors close to the BGA balls per Lattice's layout guidelines for the iCE40 UltraLite family.