Logic density and I/O budget
The ICE40HX8K-CB132 packs 7680 logic elements across 960 LABs/CLBs, with 131072 total RAM bits on die. That is enough fabric for a modest soft-core MCU, a few SPI/I2C peripherals, and glue logic — all fitting the 95 available I/O. The 95 I/O count is the middle ground in the HX8K family: two fewer than the BG121 variant (93 I/O) and 111 fewer than the CT256 (206 I/O). If your BOM needs the extra pins, the CT256 is the drop-in logic replacement in a larger BGA.
Package footprint and board integration
Housed in a 132-ball CSBGA (8x8 mm), the ICE40HX8K-CB132 is a fine-pitch BGA — the 0.5 mm ball pitch demands a 4-layer PCB minimum for fan-out. The 8x8 mm body is compact enough for space-constrained designs like camera modules or handheld instrumentation. Surface-mount assembly with a standard reflow profile; the package is tray-shipped, so plan for pick-and-place from JEDEC trays. No exposed paddle — thermal management relies on the BGA balls and board copper.
Supply voltage and temperature grade
Core supply is 1.14 V to 1.26 V — a tight 1.2 V nominal rail. The 1.2 V supply must be clean; a 1% tolerance LDO or switching regulator with <10 mV ripple is typical for this family. The I/O banks are powered separately via VCCIO pins (not listed per-pin here, but standard for iCE40). This covers outdoor telecom enclosures, automotive cabin (non-engine bay), and factory-floor controllers.