7680 logic elements in a 9x9 mm BGA
The ICE40HX8K-BG121 is a Lattice iCE40 HX family FPGA packing 7680 logic elements and 128 Kbit of block RAM into a 121-ball caBGA package that measures 9x9 mm. That logic density in a hand-assembly-friendly BGA footprint makes it a candidate for glue-logic consolidation or sensor-bridge processing where board real estate is tight. Ninety-three general-purpose I/O are available, which for a 121-ball package means a high I/O-to-ball ratio — most of the balls are signal, not power or ground. That suits designs where you need to interface to a parallel bus or a bank of sensors without giving up half the package to supply rails. The 1.14 V to 1.26 V core supply means a single 1.2 V rail powers the fabric; no separate VCCIO for the core.
Package and board-fit considerations
The 121-caBGA (9x9 mm) has a 0.8 mm ball pitch — a standard 4-layer PCB with via-in-pad can route all 93 I/O. The 0.8 mm pitch is forgiving enough for most rework stations; a hot-air rework profile with bottom-side preheat handles removal without lifting pads. Supplied in Tray packaging, not tape-and-reel.