Logic density and memory for glue-logic and sensor fusion
The ICE40HX4K-CB132 packs 3520 logic elements (440 LABs/CLBs) and 81920 total RAM bits, making it a solid fit for bridging sensor interfaces, implementing small state machines, or handling display timing control in portable gear. With 95 user I/O in a 132-ball CSBGA (8x8 mm), you get enough pins to connect a parallel camera sensor, a few SPI peripherals, and a parallel LCD bus without needing a larger package.
Temperature grade and supply rails
Core supply is 1.14 V to 1.26 V — a tight window that demands a regulated rail, not a raw battery tap. A small LDO or buck converter feeding the VCC core keeps the FPGA happy.
Package and board-fit considerations
Hand-soldering is possible with a hot-air station and stencil, but a reflow oven gives better yield. The package is RoHS3 compliant. Surface-mount only; no through-hole variant exists. Plan for a 4-layer board minimum to fan out the inner balls.
Sourced to order through independent distribution; availability and current pricing confirmed at RFQ. No stock-holding claim — quoted per your BOM quantity.