Logic density and I/O for glue-logic integration
The ICE40HX4K-BG121 packs 3520 logic elements across 440 LABs/CLBs, with 93 user I/O brought out to the 121-ball caBGA — enough for moderate-density bridging, sensor aggregation, or display control in an embedded system. On-chip block RAM totals 81920 bits, sized for small FIFOs, coefficient tables, or line buffers without external SRAM.
Industrial temperature range and supply tolerance
Core supply accepts 1.14 V to 1.26 V — the 1.2 V nominal rail with ±5 % tolerance keeps the fabric within timing closure across the temperature range.
Package footprint and board integration
The 121-caBGA (9x9 mm) with 0.8 mm ball pitch is a four-layer-board-friendly package — the outer rows fan out on a single via-in-pad layer, and the inner rows route through microvias or dog-bone traces. Surface-mount assembly with standard reflow profile; no underfill required for most industrial applications, though a corner-staking adhesive is common for high-vibration environments.
Active lifecycle and compliance posture
ROHS3 compliant per Lattice's own declaration; no REACH or conflict-minerals exemptions are noted in the standard compliance package.