Device identity and parametric fit
The Intel EPM570ZM100C7N is a MAX® II family CPLD offering 440 macrocells and 570 logic elements in a 100-ball TFBGA package (6x6 mm body). With 76 user I/O and a propagation delay of 9 ns max (tpd1), this device suits glue-logic consolidation and bus-interface tasks where pin count and speed are the binding constraints.
The 100-TFBGA package with 0.65 mm ball pitch requires controlled solder-paste deposition and X-ray inspection after reflow — a standard capability for any assembly house that handles fine-pitch BGAs.
