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Intel EPM570M100C5N — FPGA / CPLD & Programmable Logic

Intel EPM570M100C5N MAX II CPLD, 440 macrocells, 5.4 ns

MPNEPM570M100C5N
Active

Intel MAX® II CPLD, EPM570M100C5N, 440 macrocells, 76 I/O, 5.4 ns tpd, 100-TFBGA, Tray, Surface Mount, 2.5V/3.3V, 0°C~85°C.

$7.8700Ref. price · indicative, final on quote
Sourced new & surplus through independent channelsAuthenticity-screened · ESD-safe packingListing updated Aug 2026

Specifications

EPM570M100C5N specifications
ParameterValue
SeriesMAX® II
MountingSurface Mount
Programmable typeIn System Programmable
Voltage supply - internal2.5V, 3.3V
Operating temperature0°C~85°C(TJ)
PackageTray
Number of i (O)76
Case100-TFBGA
Number of macrocells440
Delay time tpd(1) max5.4 ns
Number of logic elements (Blocks)570

Product details

Speed, I/O, and supply rails for board-level fit

The EPM570M100C5N: Propagation delay tpd1(max) is 5.4 ns, which sets the combinatorial path limit — for a 50 MHz bus the 20 ns period leaves 14.6 ns of timing margin after the CPLD delay, enough for most address-decoding and state-machine logic without pipeline registers. Operating temperature range is 0°C to 85°C (TJ) — commercial grade, suited for indoor equipment, telecom racks, and industrial control cabinets where ambient stays below 70°C.

Package and board integration for the 100-TFBGA

The 100-ball TFBGA (6x6 mm, 0.65 mm pitch) requires a 4-layer PCB for fan-out — the inner balls route through microvias to inner layers, while the outer two rows break out on the top layer. A 0.30 mm via pad and 0.15 mm drill keep the escape routing feasible. The device is in-system programmable via the JTAG interface — no socket or pre-programming needed; the design can be updated on the assembled board through the 4-pin header. Supplied in tray format — the 100-TFBGA trays are JEDEC-standard, compatible with pick-and-place feeders without tooling change.

Sourcing posture for the active MAX II line

The MAX II family has been a long-running production line, and the 100-TFBGA package is a standard offering that is unlikely to see a short-notice discontinuation.

Frequently asked questions

What is the replacement or equivalent for EPM570M100C5N?

The MAX II family has no direct drop-in replacement with the same macrocell count and package. For a BOM redesign, the closest functional peer in the same family would be a higher-density MAX II device in the same 100-TFBGA footprint, but a board spin is required to change the density.

What is the pinout and footprint of EPM570M100C5N?

The package is a 100-ball TFBGA (6x6 mm) with a 0.65 mm ball pitch. The pinout is defined in the MAX II device family datasheet — the 76 I/O are distributed across four banks with dedicated VCCIO and GND balls. No pinout detail is reproduced here; the Intel documentation provides the full ball-map.

How can I order EPM570M100C5N or check stock?

No stock-holding claim is made; submit an RFQ for a firm quote.