440-macrocell instant-on CPLD for glue-logic consolidation
The Intel EPM570GT144C3 is a MAX II family CPLD packing 440 macrocells and 570 logic elements in a 144-TQFP package. It is in-system programmable and instant-on — no external configuration memory needed, so it powers up and drives its I/O within microseconds. With 116 user I/O and a propagation delay of 5.4 ns max (tpd1), it handles address decoding, bus bridging, and state-machine tasks that would otherwise consume dozens of 74-series logic packages or a small FPGA with a serial config PROM.
Core supply and temperature grade for industrial logic
The internal supply rail runs from 1.71 V to 1.89 V — a 1.8 V nominal core that keeps dynamic power low. The 144-TQFP (20x20 mm) footprint is a common fine-pitch quad flat pack; the 0.5 mm pitch demands a controlled impedance stack-up if any I/O toggle above 100 MHz, but for typical CPLD glue-logic speeds a two-layer board with proper decoupling is sufficient.
Active production — no last-time-buy pressure
Intel lists the EPM570GT144C3 as active. For a BOM that already carries this order code, the supply chain risk is low — no imminent obsolescence to hedge against. The part ships in tray packaging, which is standard for volume assembly. No reel or tape option is listed, so pick-and-place lines should expect JEDEC trays.