The Intel EPM570GM100I5N is a MAX® II family CPLD with 570 logic elements and 440 macrocells in a 100-ball TFBGA (6x6 mm MBGA) package. It delivers a 5.4 ns pin-to-pin propagation delay and provides 76 user I/O, making it a fit for board-level glue logic, address decoding, bus bridging, and power-up sequencing in industrial control, telecom, and motor-drive applications.
The 100-TFBGA package keeps the footprint small (6x6 mm), but the BGA requires controlled soldering profiles and X-ray inspection — factor that into assembly cost if your line is used to QFP packages.
