440-macrocell CPLD for board-level glue logic
The Intel EPM570F256C5 is a MAX® II family CPLD packing 440 macrocells and 570 logic elements in a 256-ball FBGA (17x17 mm). It delivers 160 user I/O with a pin-to-pin propagation delay of 5.4 ns, making it a fit for address decoding, bus bridging, and control logic where a small FPGA would be overkill. In-system programmable via JTAG, so you can rework the logic in-circuit during prototyping or field updates.
That means Intel is still manufacturing it, no last-time-buy window to chase, and no imminent EOL notice to watch. For a storeroom spare or a production BOM line, this part is a safe bet for the next several years. Store the reels dry — the FBGA package is moisture-sensitive, and a dry-bag or cabinet keeps the solder joints reliable.