The Intel EPM570F256C3N is a MAX® II complex programmable logic device (CPLD) built on a look-up-table (LUT) architecture with 570 logic elements and 440 macrocells. It is in-system programmable via JTAG, so no external programmer is needed for board-level updates. The 256-ball FBGA (17x17 mm) package brings 160 user I/O to the board — enough for glue-logic consolidation, address decoding, or bus bridging in a mid-density design.
5.4 ns propagation delay — timing closure in context
The C3N speed grade specifies a pin-to-pin combinational delay (tpd) of 5.4 ns maximum.
What the 160 I/O and 256-BGA mean for the board
The 256-ball FBGA (17x17 mm) with 160 user I/O is a fine-pitch BGA — expect at least four PCB layers for fanout, with microvias or blind vias if routing density is high. Plan for a JTAG header (TCK, TMS, TDI, TDO) on the board for in-system programming; no external flash is needed because the MAX II configuration is stored in on-chip flash.
