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Intel EPM1270GF256C4 — FPGA / CPLD & Programmable Logic

Intel EPM1270GF256C4 MAX II CPLD, 980 macrocells, 6.2 ns

MPNEPM1270GF256C4
Active

Intel MAX® II CPLD, EPM1270GF256C4, 980 macrocells, 212 I/O, 6.2 ns tpd, 1.71V–1.89V core, 256-FBGA (17x17 mm), 0°C to 85°C, tray.

$156.0000Ref. price · indicative, final on quote
Sourced new & surplus through independent channelsAuthenticity-screened · ESD-safe packingListing updated Aug 2026

Specifications

EPM1270GF256C4 specifications
ParameterValue
SeriesMAX® II
MountingSurface Mount
Programmable typeIn System Programmable
Voltage supply - internal1.71V ~ 1.89V
Operating temperature0°C~85°C(TJ)
PackageTray
Number of i (O)212
Case256-BGA
Number of macrocells980
Delay time tpd(1) max6.2 ns
Number of logic elements (Blocks)1270

Product details

980 macrocells at 6.2 ns — where this CPLD fits

The EPM1270GF256C4 is a MAX® II CPLD from Intel, packing 980 macrocells with a propagation delay of 6.2 ns max. That delay means combinatorial logic paths settle within one 160 MHz clock period — fast enough for address decoding, bus bridging, or glue logic in a 100 MHz system without extra pipeline stages. With 212 user I/O and 1270 logic elements, this part sits above the small CPLDs (like the 128-macrocell MAX 7000 series) and into the territory where you might choose it over a small FPGA if instant-on, single-chip configuration, and deterministic timing matter more than gate count.

The core runs from 1.71 V to 1.89 V, a tight 1.8 V nominal rail. The I/O banks are not listed with a separate voltage here, but the 212 I/O on a 256-ball BGA means many of those balls are supply or ground — plan for at least four decoupling caps per side on a four-layer board. Not suitable for outdoor enclosures without active cooling, but fine in a controlled lab or indoor panel environment.

256-FBGA footprint and board integration

Housed in a 256-ball FBGA, 17 mm square with 1.0 mm ball pitch. The 0.50 mm ball diameter means the escape via is a 0.30 mm finished hole with a 0.45 mm pad — standard for a four-layer board. The centre of the package has no thermal pad; heat dissipates through the balls into the PCB copper. Surface-mount only, shipped in trays. The in-system programmability (ISP) means you can reflash it on the board via JTAG after assembly — no socket needed.

Active production — sourcing posture

This is a current-production part, not a last-time-buy or obsolete line.

Frequently asked questions

Is EPM1270GF256C4 obsolete or end of life?

No — Intel lists it as Active.