4608 logic elements and 158 I/O in a 256-ball BGA
The Intel EP2C5F256C7N is a Cyclone® II FPGA packing 4608 logic elements (LEs) in a 256-ball fine-pitch BGA (FBGA) package measuring 17x17 mm. With 158 user I/O available, this part fits designs that need moderate logic density and a wide peripheral interface — think glue-logic consolidation, sensor aggregation, or display control where the I/O count drives the BGA footprint choice. The 119808 bits of embedded RAM provide local buffering for FIFOs or small frame stores without chewing up logic elements.
Package and board-fit realities for the 256-FBGA
The 256-FBGA (17x17 mm) uses a 1.0 mm ball pitch — routable on a four-layer board with standard via fan-out under the package. The supplier device package is 256-FBGA (17x17), identical to the 256-LBGA case code; both refer to the same land pattern. The Tray packaging means the parts arrive in anti-static trays, not tape-and-reel, so plan for tray-fed pick-and-place or a tube-to-tape conversion if your line runs reel-only. The 288 logic array blocks (LABs) each contain 16 LEs, giving 4608 total. Each LAB also carries local interconnect and carry-chain logic — the 288 count is the granularity floor for floorplanning; a design that fills 90% of LABs will see routing congestion near the core edges.