Package and board-fit constraints
The 10M50DCF672I6G ships in a 672-ball FBGA (27x27 mm) with 500 user I/O — the 1.0 mm ball pitch demands a minimum 6-layer PCB for full fan-out of the outer rows; a 4-layer board will route only the perimeter balls and requires via-in-pad for the inner rings. The 27x27 mm body with no exposed thermal pad means junction-to-ambient thermal resistance is dominated by the board copper — a 2 oz copper plane under the BGA drops RθJA by roughly 20% versus 1 oz.
Logic capacity and memory budget
50,000 logic elements in 3,125 LABs/CLBs — this is the mid-range density point in the MAX 10 family, suitable for glue-logic consolidation, sensor fusion, or a soft-core MCU with peripheral set. The 1,677,312 bits of embedded RAM (≈2 Mbit) provide block memory for FIFOs, line buffers, or coefficient storage without external SRAM.
Lifecycle and supply posture
The MAX 10 family remains a current production line for Intel's programmable logic group, so the part is available through authorized distribution channels. No pin-compatible second-source exists — the 10M50DAF256I6G shares the same logic density but drops to 178 I/O in a 256-ball BGA, requiring a board spin.
