Intel MAX® 10 FPGA, 10M50DAF672I7G, 50 000 logic elements, 500 I/O, 1 677 312 total RAM bits, 1.15V–1.25V core supply, 672-FBGA (27x27 mm), -40 to 100°C junction temperature, Tray.
| Parameter | Value |
|---|---|
| Series | MAX® 10 |
| Mounting | Surface Mount |
| Supply voltage | 1.15V ~ 1.25V |
| Operating temperature | -40°C ~ 100°C (TJ) |
| Package | Tray |
| Number of i (O) | 500 |
| Case | 672-BGA |
| Total RAM bits | 1677312 |
| Number of LABs (CLBs) | 3125 |
| Number of logic elements (Cells) | 50000 |
Because it is a junction limit, forced airflow or a heatsink may be needed if the board runs near the upper bound in still air.
With 500 I/O, this part can interface to a wide parallel bus without needing a larger package. The 672-FBGA footprint is 27x27 mm.
The 10M40DAF672I6G is a pin-compatible alternative in the same 672-FBGA package with 500 I/O, 40 000 logic elements, and a faster -6 speed grade. The 10M40DAF672I7G is a slower -7 speed grade with the same 40 000 LE density.
The datasheet is Intel's MAX 10 FPGA Device Datasheet, which covers the full family including the 10M50DAF672I7G. It details the logic array, block RAM, I/O standards, configuration, and electrical characteristics.
The MAX 10 family supports multiple I/O voltage standards including 1.8V, 2.5V, and 3.3V on the I/O banks. The 1.8V operation is available on the appropriate VCCIO pins per bank.
The MAX 10 family supports LVDS on dedicated I/O banks. The 10M50DAF672I7G with 500 I/O includes LVDS-capable pairs, though the exact number depends on the bank assignment and adjacent I/O usage.