50,000 logic elements in a 672-ball BGA
The 10M50DAF672C7G is an Intel MAX 10 FPGA packing 50,000 logic elements and 500 user I/O in a 672-FBGA package measuring 27x27 mm. The 1.15-1.25 V core supply powers 1,677,312 bits of embedded RAM and 3,125 LABs/CLBs, giving you enough fabric for modest DSP pipelines, state machines, or glue-logic consolidation without an external configuration memory — the MAX 10 family is non-volatile and instant-on.
Board-level fit: 672-FBGA and commercial temp
The 672-ball BGA with 1.0 mm pitch demands at least a 4-layer PCB for fan-out; the 27x27 mm footprint leaves room for via-in-pad if you need to route all 500 I/O to the periphery. Operating temperature is 0°C to 85°C junction — this is a commercial-grade part suited for indoor equipment, test gear, and industrial control cabinets, not extended-temp or under-hood environments. Surface-mount on tray: the tray is the factory shipping medium; your assembler will need a pick-and-place feeder or a waffle-pak conversion for volume.
Active lifecycle and sourcing posture
No single-source risk on this code — multiple stocking distributors carry MAX 10 inventory.