Intel MAX 10 series FPGA, 10M50DAF484I7G, 50000 logic elements, 360 I/O, 1677312 total RAM bits, 1.15V-1.25V supply, 484-FBGA (23x23), industrial temperature -40°C to 100°C.
| Parameter / Attribute | Specification / Value |
|---|---|
| Series | MAX® 10 |
| Mounting | Surface Mount |
| Supply voltage | 1.15V ~ 1.25V |
| Operating temperature | -40°C ~ 100°C (TJ) |
| Package | Tray |
| Number of i (O) | 360 |
| Case | 484-BGA |
| Total RAM bits | 1677312 |
| Number of LABs (CLBs) | 3125 |
| Number of logic elements (Cells) | 50000 |
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Fifty thousand logic elements puts this part in the mid-density tier of the MAX 10 family. It can absorb a moderate-size soft-core processor, a few serial interfaces, and some custom glue logic without needing an external CPLD or a larger FPGA. The 360 I/O are all available on the 484-FBGA package, so board routing needs a four-layer or six-layer PCB to escape the BGA balls cleanly.
It is a current-production Intel FPGA suitable for new designs.
The datasheet is the Intel MAX 10 FPGA Device Datasheet, covering the full family including the 10M50DAF484I7G. It details the logic array, I/O standards, configuration, and electrical characteristics.
The difference is the temperature grade suffix: the I7G variant is rated for industrial temperature range (-40°C to 100°C junction), while the I6G variant typically covers a narrower commercial or extended-commercial range. The logic density, I/O count, and package are identical.