50K LE MAX 10 in a 256-ball BGA
The 10M50DAF256C6GES is an Intel MAX 10 FPGA packing 50,000 logic elements into a 256-ball FineLine BGA (17x17 mm). That logic density — 3125 LABs/CLBs — puts it in the middle of the MAX 10 lineup: enough fabric for a modest soft-core processor plus glue logic, but not so much that the 256-ball package becomes a routing bottleneck. The 178 user I/O break out to the outer two rows of the BGA, which means a 4-layer PCB with via-in-pad is the practical floor for fan-out. The 0.80 mm ball pitch is forgiving enough for a standard reflow profile, but the centre thermal pad needs a solid ground-plane stitch to keep the junction below 85 °C in a warm enclosure.
On-chip memory and supply rails
Total RAM bits come to 1,677,312 — roughly 2 Mbit of embedded memory distributed as M9K blocks. That is enough for a 256-deep FIFO on each of 64 channels or a moderate packet buffer without bolting on external SRAM. Operating temperature is 0 °C to 85 °C junction — the commercial-grade band. That suits indoor equipment, test gear, and telecom racks where the ambient stays below 70 °C. For engine-bay or outdoor cabinet duty, the industrial-grade sibling (10M50DAF256I6G) extends the range to 100 °C junction.