40K logic elements, 500 I/O — the I/O-limited variant of the MAX 10 family
The 10M40DCF672C7G: This is the highest I/O count variant within the 40K LE density tier of the MAX 10 family, suited for glue-logic aggregation or parallel bus interfaces where pin count, not logic depth, is the binding constraint. On-chip memory totals 1290240 RAM bits, distributed across the M9K blocks, with 2500 LABs/CLBs forming the logic fabric. The 1.15V to 1.25V core supply keeps dynamic power in check for a device of this density.
Active lifecycle — no end-of-life pressure on this order code
No last-time-buy window, no NRND flag, and no official successor has been published. For a BOM line that requires the 672-ball footprint with 500 I/O, this part remains a current-production choice without a forced migration timeline.
672-FBGA footprint and commercial temperature range
The 672-FBGA (27x27) package with 500 user I/O demands a multi-layer PCB for fan-out — the 1.0 mm ball pitch is manageable with standard via-in-pad or microvia processes. Surface-mount assembly per JEDEC MSL rating applies; the Tray packaging is typical for volume reflow.