Intel MAX® 10 series, 10M40DCF256C8G, FPGA, 40000 logic elements, 178 I/O, 1.15V~1.25V supply, 256-LBGA, 0°C~85°C.
| Parameter | Value |
|---|---|
| Series | MAX® 10 |
| Mounting | Surface Mount |
| Supply voltage | 1.15V ~ 1.25V |
| Operating temperature | 0°C ~ 85°C (TJ) |
| Package | Tray |
| Number of i (O) | 178 |
| Case | 256-LBGA |
| Total RAM bits | 1290240 |
| Number of LABs (CLBs) | 2500 |
| Number of logic elements (Cells) | 40000 |
The 256-FBGA (17x17 mm) package routes 178 I/O to the board. That pin density suits four-layer PCBs with blind vias; two-layer designs will need careful fan-out planning. The commercial temperature range (0°C to 85°C junction) limits deployment to indoor, conditioned environments — not for engine bays or outdoor telecom cabinets without active cooling.
The 10M40DCF256C8G is listed as Active.
The 10M40DCF256C7G is a higher-speed grade sibling (C7 vs C8 speed bin) in the same 256-FBGA package with identical logic density and I/O count. The C8G part runs at a lower maximum frequency; check your timing closure before substituting.
The datasheet covers the full MAX 10 family; the 10M40DCF256C8G is listed under the 40K LE density option with the 256-FBGA package and commercial temperature range.
The 10M40DAF256C7G is a pin-compatible alternate in the same MAX 10 series with the same logic density, RAM bits, and I/O count, but in a different package variant (AF vs CF suffix). Verify the package code before ordering.