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Intel 10M40DAF256I6G — FPGA / CPLD & Programmable Logic

Intel 10M40DAF256I6G MAX 10 FPGA, 40K LE, 178 I/O, -40 to 100°C

MPN10M40DAF256I6G
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Intel MAX® 10 FPGA, 10M40DAF256I6G, 40,000 logic elements, 1,290,240 total RAM bits, 178 I/O, 256-FBGA (17x17 mm), 1.15–1.25 V core, -40 to 100 °C junction temperature, Tray.

$23.9400Ref. price · indicative, final on quote
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MOQ1 pcs
  • 100% new & originalTraceable channels only — no refurbs, no pulls, no remarked parts.
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  • MSL-compliant ESD packingMoisture-sealed bags with indicator cards; reels photo-verified.
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Specifications

10M40DAF256I6G Technical Specifications
ParameterValue
SeriesMAX® 10
Mounting typeSurface Mount
Voltage1.15V ~ 1.25V
Operating temperature-40°C ~ 100°C (TJ)
PackageTray
Number of i (O)178
Case256-LBGA
Total RAM bits1290240
Number of LABs (CLBs)2500
Number of logic elements (Cells)40000

Product details

The Intel 10M40DAF256I6G is a MAX 10 family FPGA packing 40,000 logic elements and 1,290,240 total RAM bits in a 256-ball FBGA (17x17 mm). With 178 user I/O and a 1.15–1.25 V core supply, it targets medium-density glue logic, sensor fusion, and display interface bridging in industrial control, motor-drive feedback, and outdoor telecom equipment. The -40 to 100 °C junction temperature range covers factory-floor and enclosure-ventilated environments without a commercial-grade compromise.

178 I/O in a 17x17 mm BGA — board layout notes

The 256-FBGA footprint (17x17 mm) has 178 I/O. The core supply is 1.15–1.25 V.

Frequently asked questions

What is the replacement for 10M40DAF256I6G?

Intel has not issued an official successor for this part. The 10M40DAF256I7G is a functional peer with the same 40K LE, 1.29 Mbit RAM, and 178 I/O in the same 256-FBGA package — check the speed/temperature suffix before dropping it into a BOM slot.

What are the detailed specifications of 10M40DAF256I6G?

This MAX 10 FPGA contains 40,000 logic elements, 2,500 LABs/CLBs, 1,290,240 total RAM bits, and 178 user I/O. It operates from a 1.15–1.25 V core supply over a -40 to 100 °C junction temperature range, housed in a 256-FBGA (17x17 mm) surface-mount package.