Intel MAX® 10 FPGA, 10M16SAU169I7G, 16,000 logic elements, 562,176 total RAM bits, 130 I/O, 169-LFBGA, surface mount, 2.85 V to 3.465 V supply, -40°C to 100°C operating temperature, tray.
| Parameter | Value |
|---|---|
| Series | MAX® 10 |
| Mounting | Surface Mount |
| Voltage | 2.85V ~ 3.465V |
| Operating temperature | -40°C ~ 100°C (TJ) |
| Package | Tray |
| Number of i (O) | 130 |
| Case | 169-LFBGA |
| Total RAM bits | 562176 |
| Number of LABs (CLBs) | 1000 |
| Number of logic elements (Cells) | 16000 |
The junction temperature rating means you need to keep the die below 100°C under load; a small heatsink or forced air may be needed if the board sits near a hot power stage.
The 10M16SCU169A7G shares the same 130 I/O and 16K LE count but extends the temperature range to 125°C. The 10M16SAU169C8G drops the temperature grade to 0°C to 85°C.
It has 16,000 logic elements.
The 10M16SCU169A7G is a pin-compatible alternative with a wider temperature range of -40°C to 125°C; the 10M16SAU169C8G is a commercial-temperature (0°C to 85°C) variant. Both share the same 130 I/O and 16K LE count in the same 169-UBGA package.