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Intel 10M16DCU324I7G — FPGA / CPLD & Programmable Logic
Intel

Intel 10M16DCU324I7G MAX 10 FPGA, 16K LE, 246 I/O, Industrial Temp

MPN10M16DCU324I7G
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Intel MAX® 10 FPGA, 10M16DCU324I7G, 16,000 logic elements, 246 I/O, 562176 total RAM bits, 1.15V–1.25V supply, -40°C to 100°C industrial temperature, 324-UBGA (15x15) package, Tray.

$52.6200Ref. price · indicative, final on quote
10M16DCU324I7G datasheet
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Specifications

10M16DCU324I7G Technical Specifications
ParameterValue
SeriesMAX® 10
Mounting typeSurface Mount
Voltage1.15V ~ 1.25V
Operating temperature-40°C ~ 100°C (TJ)
PackageTray
Number of i (O)246
Case324-LFBGA
Total RAM bits562176
Number of LABs (CLBs)1000
Number of logic elements (Cells)16000

Product details

What this FPGA delivers for a board-level design

The Intel 10M16DCU324I7G is a MAX 10 family FPGA packing 16,000 logic elements and 246 user I/O in a 324-ball UBGA package. It carries 562,176 bits of embedded RAM, enough for moderate FIFO buffers or small processor scratchpads without external memory. The industrial temperature range (-40°C to 100°C) suits it for outdoor telecom, factory-floor controllers, and motor-drive interface logic where the ambient inside the enclosure can climb.

16,000 LEs and 246 I/O — what they mean for fit

Sixteen thousand logic elements and 246 I/O in a 324-ball package. Core supply is 1.15 V to 1.25 V.

Frequently asked questions

What is the difference between 10M16DCU324I7G and 10M16DCU324C8G?

The C8G suffix denotes a commercial temperature range (0°C to 85°C), while the I7G suffix on this part is the industrial-temperature variant rated for -40°C to 100°C. Logic density, I/O count, RAM, and package are identical between the two.

What is the operating temperature range of 10M16DCU324I7G?

Rated for -40°C to 100°C junction temperature, which qualifies it for industrial environments where the ambient inside the enclosure may exceed 70°C.

What is 10M16DCU324I7G's listed series?

It belongs to the Intel MAX 10 family, a non-volatile FPGA series with embedded flash configuration, instant-on capability, and single-chip operation.