16,000 logic elements in a 15×15 mm BGA
The Intel 10M16DAU324I7G is a MAX 10 FPGA packing 16,000 logic elements into a 324-ball UBGA package that measures just 15×15 mm. That logic count sits in the middle of the MAX 10 family — enough for a modest soft-core processor, a display controller, or sensor fusion logic, without the power and cost of a larger fabric. With 246 user I/O available, this BGA gives you more than one I/O per 65 logic elements — a high ratio that suits designs needing parallel buses or many external peripherals. The 562,176 bits of embedded RAM handle small FIFOs, coefficient look-up tables, or configuration cache without external SRAM.
Industrial temperature range and single-rail core
The 324-LFBGA (fine-pitch BGA) demands a 4-layer or better PCB for fan-out — the 0.8 mm ball pitch is manageable with standard via-in-pad processes, but the inner rows need dog-bone routing.
Active lifecycle — no end-of-life pressure
There is no end-of-life notice, no last-time-buy window, and no successor part number to track. Because the MAX 10 family uses non-volatile flash-based configuration, there is no external configuration memory needed — the FPGA loads its bitstream from internal flash on power-up. That simplifies the BOM and removes one single-source risk from the supply chain.