8,000 logic elements in a 11x11 mm BGA
The Intel 10M08SAU169I7G packs 8,000 logic elements into a 169-ball UBGA footprint measuring 11x11 mm — the smallest package in the MAX 10 family that still brings out 130 I/O. That I/O count is the first BOM-fit gate: 130 user-programmable pins in a 0.80 mm pitch BGA mean a 4-layer board is usually enough to fan out the inner rows, but the exact breakout depends on which banks you assign to which supply rail.
Industrial temperature grade and single-rail supply
That simplifies the power tree on a motor-drive control board or an outdoor sensor hub where every rail adds cost and board area. The 387,072 total RAM bits are organised as M9K blocks — each block is 9 Kbit true dual-port. For a typical glue-logic application, that is enough for a 256-byte FIFO per I/O bank or a small video line buffer at VGA resolution. The 500 logic-array blocks (LABs) give you 500 slices of 16 logic elements each, which maps cleanly to a 16-bit counter chain or a state machine with a dozen registered states.
Active lifecycle — no end-of-life pressure
RoHS compliant per the listing. For a BOM that needs the 130-I/O, 169-ball package with industrial temperature range, this is the part to specify. The commercial-temperature sibling 10M08SAU169C8G shares the same package and I/O count but is rated 0°C to 85°C — if your ambient stays below 85°C, that variant saves a few cents, but the I7G gives you the full -40°C margin for cold-start or high-heat environments.