8000 LEs in a 4.5×4.4 mm WLCSP — the density trade-off
The Intel 10M08DFV81I7G packs 8000 logic elements into an 81-ball WLCSP that measures 4.5×4.4 mm — that is the smallest footprint for this logic density in the MAX 10 family. The 56 user I/O are the practical constraint on peripheral integration, not the logic fabric itself. With 500 LABs/CLBs and 387072 bits of embedded RAM, this part handles small FIFO buffers, look-up tables, or state machines without external memory. The 1.15V to 1.25V core supply is a single narrow rail — the regulator tolerance must stay inside that window.
Industrial temperature and active lifecycle
The 81-VBGA WLCSP package has no exposed pad — the PCB layout relies on the BGA balls for both signal and thermal path.
Board-fit and supply rails
The core voltage must be held between 1.15V and 1.25V; a 1.2V LDO with ±2% tolerance is the typical choice. The I/O banks operate from separate supply pins — the datasheet voltage range for the I/O rails is not listed here, but the core supply window is tight enough that the regulator selection drives the BOM decision.