8000 logic elements in a 15x15 BGA — what the I/O and RAM mean for your design
The Intel MAX 10 10M08DAU324I7G packs 8000 logic elements and 246 user I/O in a 324-UBGA (15x15 mm) package — the I/O count is the highest in the 8k-LE MAX 10 family, which means you can route a memory bus, a parallel display interface, and a handful of serial peripherals without multiplexing the pins. On-chip block RAM totals 387072 bits — enough to hold a 480x272 frame buffer at 16-bit color or a moderate-size packet buffer for a bridge application, saving the BOM a separate SRAM.
Industrial temp and active lifecycle — fit for production builds
Housed in a 324-ball LFBGA (0.80 mm pitch), the 15x15 mm footprint fits a 4-layer board with blind vias for the inner ball rows — the center balls are mostly GND and VCC, so breakout is manageable with standard design rules.
How the 10M08DAU324I7G compares to the 10M08DAF484I7P
The 10M08DAF484I7P shares the same 8000 logic elements and 387072 bits of RAM but steps up to 250 I/O in a larger 484-ball FBGA package — if your board has the room and you need four extra I/O for a second SPI flash or an additional GPIO bank, the 484-ball variant is the drop-in alternative within the same MAX 10 logic density.
Sourcing the 10M08DAU324I7G — availability and pricing
Active and widely available through authorized and independent channels.