I/O count and package — routing implications
With 87 I/O brought out of 164 balls, roughly half the ball array is dedicated to power and ground. The 8x8 mm MBGA fits on a standard PCB without microvias.
RoHS compliance is confirmed.

Intel Cyclone® 10 LP FPGA, 10CL016ZM164I8G, 15408 logic elements, 516096 total RAM bits, 87 I/O, 164-TFBGA, 1.0V supply, -40°C to 100°C (TJ) operating temperature, Tray, RoHS compliant.
| Parameter | Value |
|---|---|
| Series | Cyclone® 10 LP |
| Mounting | Surface Mount |
| Supply voltage | 1.0V |
| Operating temperature | -40°C ~ 100°C (TJ) |
| Package | Tray |
| Number of i (O) | 87 |
| Case | 164-TFBGA |
| Total RAM bits | 516096 |
| Number of LABs (CLBs) | 963 |
| Number of logic elements (Cells) | 15408 |
With 87 I/O brought out of 164 balls, roughly half the ball array is dedicated to power and ground. The 8x8 mm MBGA fits on a standard PCB without microvias.
RoHS compliance is confirmed.
The operating temperature range is -40°C to 100°C (junction). That is the industrial temperature grade — suitable for outdoor telecom, factory automation, and engine-bay-adjacent electronics where ambient temperatures reach 85°C but junction stays under 100°C.
Yes, it is RoHS compliant. No lead or restricted substances in the BGA solder balls or mold compound — clears EU RoHS and most global environmental regulations without exemptions.
The 10CL016ZU164I8G is a different package variant (256-ball vs 164-ball) with a different ball map and I/O count. They share the same logic density but are not pin-compatible — a board redesign is required. The 10CL016YM164I7G is a closer functional peer in the same 164-ball footprint but uses a 1.2V core supply instead of 1.0V.