Active lifecycle — no end-of-line pressure
That means the wafer fab and assembly lines are running, the Quartus Prime software toolchain supports this device, and Intel is taking orders through its distribution channel. No last-time-buy clock is ticking. For BOM planning, this part is safe to specify into a new design today and should remain available through the typical production lifecycle of a mid-range FPGA.
Temperature grade — conditioned environments only
Rated 0°C to 85°C (TJ), this part is not specified for outdoor, under-hood, or unheated industrial enclosures.
