Active production — 33,280 logic cells in a 17x17 mm BGA
The XC7A35T-1FTG256I: The 1.0 mm pitch means this BGA routes comfortably on a 4-layer PCB without microvias, keeping board cost down for mid-density designs. The 170 user I/O spread across four banks gives enough headroom for a 16-bit DDR3 bus, a parallel LCD interface, and a handful of serial peripherals.
Industrial temperature grade and on-chip memory budget
The core supply must stay within 0.95V to 1.05V — a 50 mV window — so the voltage regulator feeding the VCCINT rail needs 1% accuracy or better at the ball. The 1,843,200 bits of block RAM (1.8 Mbit) are organised into 50 blocks of 36 Kbit each. That budget covers a 32 KB packet buffer, a 1024x768 frame line buffer, and a small FIFO for the PCIe Gen2 hard block without spilling into distributed RAM. The 2,600 CLB slices each contain four 6-input LUTs and eight flip-flops, giving roughly 20,800 registers for pipeline stages and state machines.
Package, compliance, and sourcing posture
Supplied in tray packaging (not tape-and-reel), the 256-FTBGA has a moisture sensitivity level (MSL) typical of lead-free BGAs — check the specific MSL rating on the lot certificate before reflow, as a bake cycle may be required if the floor life has been exceeded.