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AMD (Xilinx) XCV300-4BG432C4307 — FPGA / CPLD & Programmable Logic
AMD (Xilinx)

Xilinx XCV300-4BG432C4307 FPGA, 316 I/O, 432MBGA, Active

MPNXCV300-4BG432C4307
Active

Xilinx XCV300-4BG432C4307, Virtex series FPGA, 316 user I/O, 432-ball BGA package, bulk delivery, active lifecycle.

$294.66Ref. price · indicative, final on quote
XCV300-4BG432C4307 datasheet
StockContact for availability
MOQ1 pcs
  • 100% new & originalTraceable channels only — no refurbs, no pulls, no remarked parts.
  • Date & lot codes on quoteStated per line before you commit; label photos on request.
  • MSL-compliant ESD packingMoisture-sealed bags with indicator cards; reels photo-verified.
  • PayPal buyer protectionPay by T/T, PayPal or Payoneer — card payments covered end to end.

Specifications

XCV300-4BG432C4307 Technical Specifications
ParameterValue
Series*
Package_typeBulk
Product_statusActive

Product details

316 I/O, 432-ball BGA — what it means for the board

The Xilinx XCV300-4BG432C4307 is a Virtex-series FPGA with 316 user I/O. That I/O count drives the layer count and fanout strategy on the PCB — expect at least six layers to escape the BGA without via-in-pad.

Bulk packaging — what it changes for the line

This part ships in bulk, not tape-and-reel or tray. For a pick-and-place line that expects JEDEC trays, bulk delivery means you'll need to transfer parts into a feeder-compatible carrier before the machine can run. For manual assembly or small-run MRO work, bulk is fine — just plan for ESD-safe handling during transfer.

Frequently asked questions

How many I/O does XCV300-4BG432C4307 have?

The XCV300-4BG432C4307 provides 316 user I/O in a 432-ball BGA package.

What is the pinout of XCV300-4BG432C4307?

The pinout is defined by the 432-ball BGA footprint for the Virtex XCV300. The exact ball assignment is in the device datasheet — the 316 I/O are mapped to specific balls; the remaining balls are power, ground, and configuration pins.