AMD (Xilinx) XCV300-4BG432C4307 — FPGA / CPLD & Programmable Logic
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RoHS Compliant · Lead-Free EIA-481 Standard
AMD (Xilinx) / FPGA / CPLD & Programmable Logic

Xilinx XCV300-4BG432C4307 FPGA, 316 I/O, 432MBGA, Active

MPN XCV300-4BG432C4307
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Xilinx XCV300-4BG432C4307, Virtex series FPGA, 316 user I/O, 432-ball BGA package, bulk delivery, active lifecycle.

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MOQ: 1 pcs
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Full Technical Specifications

3 Parameters
XCV300-4BG432C4307 specifications
Parameter / AttributeSpecification / Value
Series*
Package_typeBulk
StatusActive
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Standard factory-sealed packaging compliant with EIA-481 standards for automated high-speed SMT pick-and-place lines.

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Technical Details & Description

The Xilinx XCV300-4BG432C4307 is a Virtex-series FPGA with 316 user I/O. That I/O count drives the layer count and fanout strategy on the PCB — expect at least six layers to escape the BGA without via-in-pad.

Bulk packaging — what it changes for the line

This part ships in bulk, not tape-and-reel or tray. For a pick-and-place line that expects JEDEC trays, bulk delivery means you'll need to transfer parts into a feeder-compatible carrier before the machine can run. For manual assembly or small-run MRO work, bulk is fine — just plan for ESD-safe handling during transfer.

Frequently asked questions

How many I/O does XCV300-4BG432C4307 have?

The XCV300-4BG432C4307 provides 316 user I/O in a 432-ball BGA package.

What is the pinout of XCV300-4BG432C4307?

The pinout is defined by the 432-ball BGA footprint for the Virtex XCV300. The exact ball assignment is in the device datasheet — the 316 I/O are mapped to specific balls; the remaining balls are power, ground, and configuration pins.

XCV300-4BG432C4307
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