The exposed pad is not present on this SOIC variant, so no thermal-via stitching is needed — the junction temperature is managed through the leadframe and copper traces.
For dual-sourcing or a second-source option, the LM5106MM/NOPB is a half-bridge driver with 1.2 A peak current and a different drive architecture — it is not a pin-compatible drop-in, but it fills a similar role if the design can accommodate the half-bridge topology and lower drive strength.