TPS79925YZUR

Texas Instruments

Texas Instruments TPS79925YZUR LDO linear regulator, fixed 2.5 V output, 200 mA, 5-DSBGA package, 70 dB PSRR at 100 Hz, 180 mV dropout at full load.

Texas Instruments TPS79925YZUR
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MOQ 1 · Tape & Reel (TR); Cut Tape (CT) · RoHS · EIA-481 · DAP/DDP · T/T

Technical specifications

TPS79925YZUR specifications
Parameter / AttributeSpecification / Value
Output typeFixed
MountingSurface Mount
Voltage - input6.5V
Voltage dropout0.18V @ 200mA
Voltage - output (Min (Fixed))2.5V
Output current200mA
Current - quiescent60 µA
Operating temperature-40°C ~ 125°C
PSRR70dB ~ 38dB (100Hz ~ 100kHz)
PackageTape & Reel (TR); Cut Tape (CT)
Case5-UFBGA, DSBGA
Control featuresEnable
Protection featuresOver Current, Over Temperature, Reverse Polarity, Under Voltage Lockout (UVLO)
Number of regulators1
Output configurationPositive

Technical details

Fixed 2.5 V rail for noise-sensitive loads

The TPS79925YZUR is a 200 mA LDO with a fixed 2.5 V output — no external resistor divider needed, but the output voltage is not adjustable. The 180 mV maximum dropout at 200 mA means the input rail must stay above 2.68 V across load and temperature to keep the output in regulation. PSRR starts at 70 dB at 100 Hz and rolls off to 38 dB at 100 kHz. That profile matters when the upstream supply is a switching converter: the LDO attenuates ripple well at line frequency and the first few harmonics, but above 100 kHz the attenuation drops by nearly half — a second-stage LC filter ahead of the LDO may be needed if the switcher runs above 500 kHz.

Quiescent draw and protection set

Quiescent current is 60 µA typical — low enough for always-on rails in battery-powered gear, but not the ultra-low-Iq class (sub-1 µA) used for wake-up circuits. The enable pin lets the system shut the rail entirely when the load is idle. Protection covers over-current, over-temperature, reverse polarity, and under-voltage lockout (UVLO). The reverse polarity protection is unusual for a small LDO and saves an external series diode when the input could be reversed during assembly or field service.

5-DSBGA — layout constraints

The 5-DSBGA (0.5 mm pitch, 0.9 mm × 1.0 mm body) has no exposed thermal pad — all heat dissipates through the solder balls and board copper. For 200 mA at 3.3 V in to 2.5 V out, the power loss is 160 mW; the junction-to-board thermal resistance (RθJB) for this package is typically 80-100 °C/W, so a 2-layer board with solid ground plane under the part keeps the junction rise under 20 °C at room ambient. The 5-DSBGA requires micro-via fan-out — a 4-layer board is not mandatory, but the inner layers help spread heat. The supplier device package is 5-DSBGA; the package/case is 5-UFBGA, DSBGA, meaning the same land pattern serves both wafer-level and fine-pitch BGA variants.

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