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Texas Instruments TPS60302DGS — Discrete Semiconductors

TPS60302DGS Texas Instruments Charge Pump, 40mA/20mA

MPNTPS60302DGS
End of Life

Texas Instruments TPS60302DGS charge pump IC, ratiometric step-up, fixed output, 40mA/20mA, 700kHz, 10-VSSOP, tube.

$2.8Ref. price · indicative, final on quote
Packaging10-TFSOP, 10-MSOP (0.118", 3.00mm Width)
RoHSROHS3 Compliant
Sourced new & surplus through independent channelsAuthenticity-screened · ESD-safe packingListing updated Aug 2026

Specifications

TPS60302DGS specifications
ParameterValue
Output typeFixed
MountingSurface Mount
Voltage - input1.8V
Voltage - output (Min (Fixed))2Vin, 3.3V
Output current40mA, 20mA
Frequency700kHz
I/O channels2
Operating temperature-40°C ~ 125°C (TJ)
PackageTube
FunctionRatiometric, Step-Up
TopologyCharge Pump
Case10-TFSOP, 10-MSOP (0.118\", 3.00mm Width)
Output configurationPositive
Synchronous rectifierNo

Product details

Dual-rail charge pump for 0.9 V to 1.8 V input rails

The TPS60302DGS is a charge-pump step-up converter generating two fixed outputs from a single input rail that can drop as low as 0.9 V and max out at 1.8 V. One output tracks the input voltage ratiometrically (2×Vin), while the other holds a regulated 3.3 V rail — meaning a single device powers both a VDD tracking supply and a fixed 3.3 V bus from a battery that sags below 1 V. Output current is split: 40 mA on the ratiometric channel and 20 mA on the 3.3 V channel. Operating temperature spans -40°C to 125°C junction, covering automotive cabin and under-hood sensor modules that see high ambient heat. The device does not use synchronous rectification, so the Schottky diode in the charge-pump path must be selected for the load current and switching frequency.

Package and board-fit note

Supplied in tube, the 10-VSSOP package has a 0.50 mm lead pitch and a 3.00 mm body width. The exposed die-attach pad is not present — this is a non-thermal-pad MSOP, so thermal dissipation relies on the copper pad area under the package on the PCB top layer. Surface-mount assembly with standard reflow profiles for MSOP-10. The low pin count means fan-out is possible on a two-layer board, but the 0.50 mm pitch still benefits from a solder-mask-defined pad for consistent solder-joint volume.