Package and mounting — 8-SON (3x3) for space-constrained boards
The TPS3851G33EDRBR is supplied in an 8-SON (3x3) package with an exposed pad for thermal dissipation. The small footprint suits designs where board area is at a premium, such as sensor modules, compact motor controllers, or portable instruments. The exposed pad must be soldered to a thermal land on the PCB to achieve the rated thermal performance. The part is surface-mount only; no through-hole variant exists.
Lifecycle and sourcing — active production, no LTB risk
The TPS3851G33EDRBR carries an active lifecycle status. The part is ROHS3 compliant.