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Texas Instruments TPS22930AYZVT — Power Management (PMIC / Gate Driver)

TPS22930AYZVT Load Switch – 35 mOhm, 2 A, DSBGA-4

MPNTPS22930AYZVT
Active

Texas Instruments TPS22930AYZVT, single-channel P-channel load switch, 35 mOhm Rds(on) typ, 2 A max output, 1.4 V to 5.5 V load range, 4-DSBGA package, slew-rate controlled, active production.

$1.3700Ref. price · indicative, final on quote
Packaging4-XFBGA, DSBGA
RoHSROHS3 Compliant
Independent supplier — new & surplus stockAuthenticity-screened · ESD-safe packingListing updated Aug 2026

Specifications

TPS22930AYZVT specifications
ParameterValue
Input typeNon-Inverting
Output typeP-Channel
TypeGeneral Purpose
MountingSurface Mount
Voltage - load1.4V ~ 5.5V
Voltage - supply (Vcc (Vdd))Not Required
Output current2A
I/O channels1
InterfaceOn/Off
Operating temperature-40°C~85°C(TA)
PackageTape & Reel (TR); Cut Tape (CT)
FeaturesSlew Rate Controlled
Rds on35mOhm
Case4-XFBGA, DSBGA
Fault protectionReverse Current, UVLO
Output configurationHigh Side
Ratio - Input:Output1:1

Product details

The TPS22930AYZVT is a single-channel, high-side P-channel load switch from Texas Instruments. It switches a load rail from 1.4 V to 5.5 V and delivers up to 2 A continuously. The switch is controlled by a single On/Off logic input and does not require a separate Vcc supply. The input is non-inverting, so a logic high turns the output on. The slew-rate controlled turn-on limits inrush current when the load has a large input capacitance — useful for power-sequencing or hot-plug applications. Protection features include reverse current blocking and undervoltage lockout (UVLO). Reverse current protection prevents back-feed from the output to the input when the input voltage drops below the output — a common concern in multi-rail systems where a downstream rail holds up longer than the upstream supply.

Package, temperature grade, and layout notes

The 4-DSBGA package (0.88 x 0.88 mm) requires micro-vias or via-in-pad for fan-out. Mounting is surface-mount only. Because the DSBGA has no exposed thermal pad, the primary heat path is through the solder bumps into the board copper — ensure adequate copper area on the top layer under the package.

Texas Instruments has not issued an end-of-life notice for this part.

Frequently asked questions

What package does TPS22930AYZVT use?

It comes in a 4-bump DSBGA (wafer-level chip-scale) package, supplier device package 4-DSBGA (0.88 x 0.88 mm). The bumps are on a 0.5 mm pitch.

Does TPS22930AYZVT have reverse current protection?

Yes — reverse current protection and undervoltage lockout (UVLO) are built in. This prevents back-feed from the output to the input when the input rail droops.