Its headline rating is an 18.3 mOhm typical on-resistance, which sets the conduction loss at 2 A to about 73 mW — manageable in a small BGA footprint if the PCB copper pours are adequate.
Load discharge and slew-rate control — why they matter on a power rail
Built-in load discharge pulls the output down when the switch is off, preventing floating rails that can cause erratic logic states during power sequencing. The slew-rate controlled turn-on limits inrush current into capacitive loads, which avoids a voltage droop on the upstream supply that could reset other devices on the same rail.
6-DSBGA — footprint and assembly reality
The 6-DSBGA package is a 0.4 mm pitch wafer-level chip-scale package. It requires a solder-mask-defined pad layout and a stencil designed for BGA assembly. Not a hand-solder part — plan for an SMT line with X-ray inspection. The tape-and-reel or cut-tape option suits both prototyping and volume pick-and-place.