TPS22914BYFPR

Texas Instruments

Texas Instruments TPS22914BYFPR, a single-channel N-channel high-side load switch in a 4-bump DSBGA package, rated 2 A continuous output with 37 mOhm typical on-resistance over a 1.05 V to 5.5 V load range.

Texas Instruments TPS22914BYFPR
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MOQ 5 · Tape & Reel (TR); Cut Tape (CT) · RoHS · EIA-481 · DAP/DDP · T/T

Technical specifications

TPS22914BYFPR specifications
Parameter / AttributeSpecification / Value
Input typeNon-Inverting
Output typeN-Channel
TypeGeneral Purpose
MountingSurface Mount
Voltage - load1.05V ~ 5.5V
Voltage - supply (Vcc (Vdd))Not Required
Output current2A
I/O channels1
InterfaceOn/Off
Operating temperature-40°C~85°C(TA)
PackageTape & Reel (TR); Cut Tape (CT)
FeaturesSlew Rate Controlled
Rds on37mOhm
Case4-XFBGA, DSBGA
Output configurationHigh Side
Ratio - Input:Output1:1

Technical details

Active production — what this means for your BOM

2 A output, 37 mOhm — sizing the load switch

Rated for 2 A continuous output current, the TPS22914BYFPR can power a modest peripheral rail, sensor cluster, or sub-regulator input. The 37 mOhm typical Rds(on) at 5 V bias means a voltage drop of roughly 74 mV at full load — negligible for most 3.3 V or 5 V rails, but worth checking against the downstream supply tolerance. The load voltage range spans 1.05 V to 5.5 V, covering common logic and I/O voltages. No external Vcc supply is required — the switch is self-biased from the load voltage.

Slew-rate control and thermal design

The slew-rate controlled turn-on limits inrush current when switching into a capacitive load, which prevents upstream supply droop and reduces EMI. This is a practical feature for power-sequencing or hot-swap applications where a sudden current surge could reset a shared rail.

Package and footprint — what to expect

Housed in a 4-bump DSBGA package, the TPS22914BYFPR requires a fine-pitch layout with a solder-mask-defined pad. The supplier device package is 4-DSBGA. Surface-mount assembly is standard, but the small bump size means a clean stencil aperture and reflow profile are critical to avoid head-in-pillow defects.

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