28-HTSSOP footprint and protection features
Packaged in a 28-HTSSOP (4.40 mm width, PowerTSSOP), the exposed pad on the bottom side is the primary thermal path — your PCB layout needs a thermal via array under the pad to pull heat into the ground plane. The part includes depop (pop-free startup/shutdown), short-circuit protection, and thermal protection, which means you can skip external muting relays in many designs and rely on the internal fault handling for production-level robustness. Mounting is surface-mount only; no through-hole variant exists.
Active production — no LTB watch needed
Lifecycle status is Active and the part is ROHS3 compliant. No end-of-life notice or last-time-buy window is known, so it is safe to qualify into a new BOM.