TMS320F28068UPFPS — C2000 Piccolo MCU, 90MHz, 256KB Flash, USB, 40 I/O
Texas Instruments TMS320F28068UPFPS, C2000 C28x Piccolo series, 32-bit single-core MCU, 90MHz, 256KB Flash, 50KB RAM, USB/CANbus/SPI/UART/I2C, 12-channel 12-bit ADC, 40 I/O, 1.71V–1.995V, -40°C–125°C, 80-TQFP exposed pad (Tray).
Specifications
| Parameter | Value |
|---|---|
| Series | C2000™ C28x Piccolo™ |
| Mounting | Surface Mount |
| Oscillator type | Internal |
| Program memory type | FLASH |
| Voltage - supply (Vcc (Vdd)) | 1.71V ~ 1.995V |
| Operating temperature | -40°C~125°C(TA) |
| Speed | 90MHz |
| Package | Tray |
| RAM size | 50K x 16 |
| Core size | 32-Bit Single-Core |
| Peripherals | Brown-out Detect/Reset, DMA, POR, PWM, WDT |
| Connectivity | CANbus, I²C, McBSP, SCI, SPI, UART/USART, USB |
| Number of i (O) | 40 |
| Core processor | C28x |
| Case | 80-TQFP Exposed Pad |
| Data converters | A/D 12x12b |
| Program memory size | 256KB (128K x 16) |
Frequently asked questions
Is the TMS320F28068UPFPS firmware-compatible with projects built in Code Composer Studio 6.x?
Code Composer Studio supports the C2000 F2806x family across multiple toolchain versions. Projects built on CCS 6.x for the F28068 should migrate without major rewrites, but the IDE and compiler version should be verified against TI's Code Composer Studio release notes for C2000 device support to confirm full feature coverage for the USB peripheral on the UPFPS variant.
For a line-down replacement, does the 40-I/O count on the F28068UPFPS require remapping against the F28069?
The F28068UPFPS and F28069 share the same 80-pin base footprint and 40-I/O count, suggesting pin-compatible drop-in for the peripheral subset that does not include USB. The USB PHY on the UPFPS variant occupies silicon die area that does not exist on the non-USB variants, so the pinout in the USB-enabled region differs — firmware pin-mux configuration must be reviewed against the target board before treating it as a drop-in without qualification.
The lifecycle_stage is eol_hot — what does this mean for sourcing 10–100 unit quantities?
End-of-life-hot means authorized-distributor inventory is being drawn down and new production orders are either constrained or not accepted. Panel-build quantities of 10–100 units should be confirmed via RFQ; the sourcing posture is quoted-to-order rather than shelf-available. If the production run extends beyond the last-time-buy window, a second-source qualification or a formal substitute from TI's product transition notice should be initiated now.
Does the 80-TQFP exposed pad require any specific handling before panel mount?
The 80-TQFP exposed thermal pad must be soldered to a properly designed thermal land with via-in-pad treatment per the package datasheet layout guidelines. Moisture-sensitivity level (MSL) information for this device should be confirmed against the MSL rating on the TI datasheet or the tray/tube packaging label — it is not listed in the available spec fields and should be verified before reflow profiling.