Active production — no lifecycle risk for BOM continuity
The TLV2764IN: ROHS3 compliant, so it ships into global markets without RoHS conflict.
Low-power quad op-amp in a through-hole DIP
Four general-purpose op-amp circuits in a single 14-DIP (0.300", 7.62 mm) package — the quad configuration saves board space and per-channel power compared to using four separate single op-amps. Supply span runs from 1.8 V minimum to 3.6 V maximum — this single-supply range covers Li-ion battery voltage and 1.8 V / 2.5 V / 3.3 V logic rails without needing a split supply. Each channel draws 20 µA typical — the total quiescent current for the quad device is 80 µA, making it a fit for battery-powered sensor nodes or always-on analog front-ends where every microamp counts. Rail-to-rail output swings within millivolts of the supply rails, and each channel can source or sink 10.2 mA — enough to drive a low-impedance load or an ADC input without losing headroom.
500 kHz GBW and 0.23 V/µs slew — bandwidth budget for sensor conditioning
Gain-bandwidth product is 500 kHz — for a closed-loop gain of 10, the usable signal bandwidth is about 50 kHz, which covers most slow sensor outputs (temperature, pressure, strain gauges) and audio-frequency filtering. Slew rate is 0.23 V/µs — at a 2 V peak-to-peak output swing, the full-power bandwidth is roughly 18 kHz; above that, the output waveform distorts. This matters if the op-amp drives a fast ADC input or must reproduce a pulse edge cleanly. Input bias current is 3 pA typical — low enough for high-impedance sources like photodiode transimpedance amplifiers or pH probe buffers, where bias current error would otherwise dominate the offset. Input offset voltage is 550 µV — moderate for a general-purpose CMOS op-amp; for precision DC applications below 1 mV error budget, an external trim or a zero-drift architecture would be needed.
Industrial temperature range — -40°C to 85°C
Rated for -40°C to 85°C ambient — this covers most factory-floor, outdoor telecom cabinet, and automotive cabin environments. Not rated for under-hood (125°C) or military-grade extended temperature. Through-hole 14-DIP package is breadboard-friendly and easy to hand-solder for prototyping or low-volume production, though the footprint is larger than equivalent SMD packages like TSSOP-14.