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Texas Instruments TLV2422MFKB — Memory (DRAM / SRAM / Flash / EEPROM)

TLV2422MFKB General Purpose Op-Amp, 5.3 MHz, Rail-to-Rail

MPNTLV2422MFKB
End of Life

Texas Instruments Automotive, AEC-Q100, LinCMOS™ series, TLV2422MFKB, dual general-purpose op-amp, 5.3 MHz gain bandwidth, 0.02 V/µs slew rate, rail-to-rail output, 2.7 V to 10 V supply, -55°C to 125°C, 20-CLCC package.

$26.15Ref. price · indicative, final on quote
Packaging20-CLCC
StockContact for availability
MOQ1 pcs
  • 100% new & originalTraceable channels only — no refurbs, no pulls, no remarked parts.
  • Date & lot codes on quoteStated per line before you commit; label photos on request.
  • MSL-compliant ESD packingMoisture-sealed bags with indicator cards; reels photo-verified.
  • PayPal buyer protectionPay by T/T, PayPal or Payoneer — card payments covered end to end.

Specifications

TLV2422MFKB Technical Specifications
ParameterValue
SeriesAutomotive, AEC-Q100, LinCMOS™
Output typeRail-to-Rail
Mounting typeSurface Mount
Amplifier typeGeneral Purpose
Voltage - input offset300 µV
Voltage - supply span2.7 V
Current - supply100µA (x2 Channels)
Current - input bias1 pA
Current - output (Channel)50 mA
Operating temperature-55°C ~ 125°C
Gain bandwidth product5.3 MHz
PackageBulk
Slew rate0.02V/µs
Case20-CLCC
Number of circuits2

Product details

What this dual op-amp actually does

The Texas Instruments TLV2422MFKB is a dual general-purpose operational amplifier from the LinCMOS™ series, qualified to AEC-Q100 for automotive use. It delivers a gain bandwidth product of 5.3 MHz with a rail-to-rail output stage, drawing just 100 µA per channel from a supply between 2.7 V and 10 V. The input bias current is a mere 1 pA, and the input offset voltage is trimmed to 300 µV. Housed in a hermetic 20-CLCC (ceramic leadless chip carrier) package, it operates across the full military temperature range of -55°C to 125°C. This combination makes it a fit for sensor conditioning, battery monitoring, and signal buffering in automotive ECUs, avionics, or downhole instrumentation where the ceramic package and wide temperature range are non-negotiable.

Hermetic 20-CLCC — the package tells the reliability story

The 20-lead ceramic LCC (20-LCCC, 8.89×8.89 mm) is a hermetic package designed for high-reliability and sealed environments. It is surface-mount, but the ceramic body and lid mean it handles moisture, vibration, and thermal cycling better than plastic SOIC or TSSOP equivalents. If your BOM calls for a part that survives conformal coating, vacuum, or extended temperature swings without popcorn cracking, this package is the reason to specify it. The AEC-Q100 qualification backs that up for automotive under-hood or chassis domains.

Sourcing and lifecycle — active, but RoHS non-compliant

The TLV2422MFKB is listed as Active in production. RoHS status is non-compliant.

Frequently asked questions

When sourcing TLV2422MFKB, what is the closest functional second-source — TLV9351IDCKR?

The TLV9351IDCKR is a single-channel op-amp with a 3.5 MHz GBW and 20 V/µs slew rate, but it is a different package (SOT-23) and lacks the hermetic ceramic construction and full military temperature range of the TLV2422MFKB. It is not a pin-compatible drop-in replacement; the TLV2422MFKB occupies a unique niche for high-reliability, dual-channel, low-power applications in a CLCC package.

Will TLV2422MFKB drop into a panel that was specified around TLV9351IDCKR without rewiring?

No. The TLV9351IDCKR is a single-channel op-amp in a 5-pin SOT-23 package, while the TLV2422MFKB is a dual-channel op-amp in a 20-pin ceramic LCC. The pinout, footprint, and channel count are completely different — a board designed for the TLV9351IDCKR would require a full layout change to use the TLV2422MFKB.