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TLV2362IDR

TLV2362IDR Texas Instruments Dual Op-Amp, 7 MHz, 8-SOIC

MPNTLV2362IDR
End of Life

Texas Instruments TLV2362IDR dual general-purpose op-amp, 7 MHz gain bandwidth, 3V/µs slew rate, 2-5V supply, 8-SOIC package, -40 to 85°C.

$0.86Ref. price · indicative, final on quote
Packaging8-SOIC (0.154", 3.90mm Width)
RoHSROHS3 Compliant
Independent supplier — new & surplus stockAuthenticity-screened · ESD-safe packingListing updated Aug 2026

Specifications

TLV2362IDR specifications
ParameterValue
MountingSurface Mount
Amplifier typeGeneral Purpose
Voltage - input offset1 mV
Voltage - supply span5 V
Current - supply1.75mA (x2 Channels)
Current - input bias20 nA
Current - output (Channel)20 mA
Operating temperature-40°C ~ 85°C
Gain bandwidth product7 MHz
PackageTape & Reel (TR); Cut Tape (CT)
Slew rate3V/µs
Case8-SOIC (0.154\", 3.90mm Width)
Number of circuits2

Product details

Dual op-amp with 7 MHz GBW in SOIC-8

The TLV2362IDR is a dual-channel general-purpose operational amplifier from Texas Instruments, packing two independent op-amps into a single 8-SOIC package. It's a solid choice for signal conditioning, active filters, and buffer stages where you need moderate speed and a wide supply range. The 2V to 5V supply span means it runs from a single lithium cell or a regulated 3.3V/5V rail without extra level shifting.

Parametric fit for signal-chain designs

Each channel draws 1.75 mA supply current, so the dual part pulls about 3.5 mA total, keeping the thermal budget light in a compact SOIC-8 layout. Output can source or sink 20 mA per channel, enough to drive a following ADC input or a small signal relay directly.

Package and board integration

The 1.27 mm pin pitch and standard SOIC footprint make it a drop-in for many existing dual-op-amp layouts. Available in Tape & Reel (TR) or Cut Tape (CT) options, the TLV2362IDR suits both prototyping runs and production reels. Surface-mount only — no through-hole variant in this series.

ROHS3 compliant — no exemptions to track for EU markets.

Frequently asked questions

Can I hand-solder the TLV2362IDR?

Yes, the 8-SOIC package with 1.27 mm pitch is hand-solderable with a fine-tip iron. No hot-air or reflow oven required for prototyping.