Parametric fit for low-power, wide-temperature deployment
Input bias current is 10 pA typical, so the TLV2170IDGKT works with high-impedance sources like photodiodes or pH probes without loading the sensor.
Package and board-fit for space-constrained layouts
Housed in an 8-VSSOP package (3.00 mm × 3.00 mm body, 0.65 mm pitch), the TLV2170IDGKT fits dense mixed-signal boards. The surface-mount 8-VSSOP footprint is shared with many general-purpose op-amps, so a single PCB layout can serve multiple BOM positions. Offered in Tape & Reel and Cut Tape options. ROHS3 compliant — no restricted substances under the current exemption list.